PCB capabilities:
| Items | Parameter | Special | |
| Layers Counts | 2-20 | ||
| Board material | FR-4,Aluminum | High Tg FR4 | |
| max Fabrication area | 580×700mm | 500mm×3000mm | |
| Board thickness | 0.1-3.2mm | ||
| Camber | Double Side: d ≤0.075mm multi -layers: d ≤1% | d≤0.05mm | |
| Impedance | ±7% | ±5% | |
| PTH tolerance | d>5.0 | ±0.076mm | |
| 0.3<d≤5.0 | ±0.05mm | ||
| d≤0.3 | ±0.08mm | ||
| Min finished hole size | 0.15mm | ||
| Hole copper thickness | ≥20um | ||
| Min track width, spacing | 0.05mm ×0.05mm | ||
| Profile size | ±0.1mm | ±0.05mm | |
| Profile | Routing,Punch,Cut,V-cut,Chanfer | ||
| Surface finish | Immersion Gold:0.025~0.075um | ||
| Gold finger:≥0.13 um | ≥1.0 um | ||
| OSP:0.2-0.5µm | |||
| HAL:5~20 um | |||
| LEADFREE HAL:5~20 um | |||
| Surface plating | Solder mask: Black Green White Red Thickness≥17um,Block,BGA | ||
| Character : Black Yellow Green White style: Highness≥0.0.625mm Width≥0.125mm | |||
| Ppeelable mask: red bule thickness≥300 um | |||
| Carbonink : Black thickness≥25 um Highness≥0.30mm Width≥0.3mm |
PCBA capabilities:
1) SMT assembly including BGA assembly
2) Accepted SMD chips: 01005, BGA, QFP, QFN, TSOP
3) Component height: 0.2-25mm
4) Min packing: 0201
5) Min distance among BGA: 0.25-2.0mm
6) Min BGA size: 0.1-0.63mm
7) Min QFP space: 0.35mm
8) Min assembly size: (X) 50 * (Y) 30mm
9) Max assembly size: (X): 350 * (Y) 550mm
10) Pick-placement precision: ±0.01mm
11) Placement capability: 0805, 0603, 0402, 0201
12) High-pin count press fit available
13)SMT capacity per day: 800,000 points
Advantages of PCB and PCB assembly:
1) Strict product liability, taking IPC-A-160 standard
2) Engineering pretreatment before production
3) Production process control (5ms)
4) 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
5) 100% AOI inspection, including X-ray, 3D microscope and ICT
6) High-voltage test, impedance control test
7) Microsection, soldering capacity, thermal stress test, shocking test
8) In-house PCB production
9) No minimum order quantity and free sample
10) Focus on low to medium volume production
11) Quick and on-time delivery